展会同期将举办半导体与集成电路产业发展高峰论坛、技术交流会、投融资对接会、首发首秀等多场专业活动，集聚顶尖专家、企业高管与投资机构，深度探讨全球半导体和集成电路发展趋势与关键应用场景。期间，多场半导体制造、集成电路、电子电力、电子制造、显示制造以及汽车、信息通信、消费电子等领域的供需对接会将作为展会的最大的亮点，对接会以采购商与参展商对一面对面交流形式进行，通过交流对接完成产品细节的交流与信息的收集，旨在推动产业链上下游企业之间的精准商务合作。

    During the exhibition, there are a series of activities held, including the Semiconductor and Integrated Circuit Industry Development Summit, Technology Exchange Meetings, Investment and Financing Matchmaking Meetings, Product Launches and Debuts. It will bring together top experts, corporate executives, and investment institutions to engage in in-depth discussions on development trends and key application scenarios of global semiconductor and integrated circuit. Multiple supply-and-demand matchmaking meetings covering semiconductors, integrated circuits, electronic power, electronics manufacturing, display manufacturing, as well as automotive, information and communications, and consumer electronics will serve as a major highlight of the exhibition. The matchmaking meetings take the form of face-to-face interactions between buyers and exhibitors to discuss product details and gather information, aiming to facilitate precise business cooperation among upstream and downstream enterprises in the industry chain.