展品大类|Major Exhibits

• IC设计/芯片与应用：IC及相关电子产品设计、EDA、AI算力芯片、存储芯片、汽车芯片、智能家电芯片、人工智能芯片及物联网、人工智能、汽车电子、智慧城市、智能终端、健康医疗等产品；

IC Design / Chips and Applications: IC and related electronic product design, EDA, AI computing power chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products in the fields of the Internet of Things (IoT), AI, automotive electronics, smart cities, smart terminals, healthcare, etc.

• IC制造：半导体晶圆制造、半导体封装与测试技术及产品；

IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging, and testing technologies and products, etc.

• 先进封装：倒装、凸点、晶圆级封装、2.5D/3D先进封装(TSV及TGV))、扇出型晶圆级封装等设计、材料、测试、设备等；

Advanced Packaging: Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), fan-out wafer-level packaging, as well as related design, materials, testing, and equipment, etc.

• 晶圆设备/封测设备：晶圆加工过程中所需的各种精密设备及半导体封装设备、半导体测试设备、IC测试仪器、先进封装工艺（如SiP、3D封装）设备、功率器件设备等；

Wafer Equipment / Packaging and Testing Equipment: Precision equipment and semiconductor packaging equipment required for wafer processing, semiconductor testing equipment, IC testing instruments, equipment for advanced packaging processes (such as SiP and 3D packaging), and power device equipment, etc.

• 化合物半导体及功率器件：化合物半导体材料（如GaN、SiC等）及其相关产品，包括功率器件、射频器件及上游设备、材料等；

Compound Semiconductors and Power Devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, as well as upstream equipment and materials, etc.

• 半导体材料：单晶硅、硅片及硅基材料、抛光垫、掩膜版、溅射靶材、抛光液、刻蚀溶液、陶瓷封装材料、键合丝、引线框架、封装基板、光刻胶、薄膜沉积材料、特种气体、超纯水、塑封材料、高性能塑料等；

Semiconductor Materials: Monocrystalline silicon, wafers and silicon-based materials, polishing pads, photomasks, sputtering targets, polishing slurries, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.

• 半导体核心零部件：机器视觉、传感器、密封圈、精密轴承、金属零部件、Valve阀、硅/SiC件、Robots、石英件、过滤器、射频电源、陶瓷件、ESC静电吸盘、压力Gauge、泵、MFC流量计、步进马达、运动控制、伺服电机、直线模组、无尘拖链、封装模具、制冷设备、感应加热器等；

Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC components, robots, quartz components, filters, RF power supplies, ceramic components, ESC electrostatic chucks, pressure gauges, pumps, MFC flow controllers, stepper motors, motion control systems, servo motors, linear modules, cleanroom drag chains, packaging molds, cooling equipment, induction heaters, etc.

• AI算力：AI芯片、服务器、交换器、电源、液冷温控等；

AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, etc.

• 配套设施与服务：支持产品/无尘室、一般商业服务/咨询、销售及服务、标准与其他。

Supporting Facilities and Services: Product support/cleanrooms, general business services/consulting, sales and services, standards, etc.

展区设置|Exhibition Areas

1、IC设计/芯片与应用IC Design / Chips and Applications Pavilion

2、IC制造IC Manufacturing Pavilion

3、晶圆设备Wafer Equipment Pavilion

4、封测设备Packaging and Testing Equipment Pavilion

5、核心零部件及材料Core Components and Materials Pavilion

6、化合物半导体及功率器件Compound Semiconductors and Power Devices Pavilion

7、AI算力AI Computing Power Pavilion

8、配套设施与服务Supporting Facilities and Services Pavilion

9、各省市地方展团与区域集群Provincial and Municipal Pavilions & Regional Clusters Pavilion

聚焦“高端芯”与“国产替代”的最新突破，打造行业最前沿的技术展示平台。

Focusing on the latest breakthroughs in “high-end chips” and “domestic substitution,” the event strives to provide a cutting-edge platform for showcasing industry-leading technologies.

观众组织|Target Audiences

本次展会将全力邀请全球半导体、集成电路、电子电力、电子制造、显示制造以及汽车、航空航天、医疗卫生、信息通信、消费电子等领域专业人士齐聚杭州，共探前沿科技，共商合作大计，携手解码产业新生态，合力共筑开放、协同、韧性的全球半导体与集成电路产业“芯”未来。

It will attract professionals from around the world in semiconductors, IC, electronic power, electronics manufacturing, display manufacturing, as well as automotive, aerospace, healthcare, information and communications, and consumer electronics to participate in the exhibition. The event provides an efficient platform for participants to explore cutting-edge technologies, discuss collaborative strategies, jointly decode the new industrial ecosystem, and work together to build an open, collaborative, and resilient core future for the global semiconductor and IC industry.

预定展位|Booth Reservation

请立即预定“SICE 2026”展位，越早预留位置越佳，争取最大曝光率，领先竞争对手，开拓无限商机。

Your timely reservation will allow us to preassign exhibit space. Requests for exhibit space will be accepted on a “first come, first served” basis.

如欲预订“SICE 2026”采购交易会展位，或了解更多信息，请发电子邮件至info@goldenexpo.com.cn 。或通过以下联络方法，预订展位。

To reserve the booth of “SICE 2026” or learn more information, please contact:

电话/ Tel : (86-21) 6439-6190

E-mail: info@goldenexpo.com.cn