展品大类|Major Exhibits

• 核心基础元器件：微型片式阻容元件、微型大电流电感器、微型射频滤波器、微型传感器车规级传感器、高端锂电、变压器、微特电机、射频阻容元件、超级电容器、控制继电器、中高频元器件、特种 PCB、伺服电机、高速传输线缆及连接组件、光通信器件等；

Core Foundational Components: Miniature chip-type resistors and capacitors, miniature high-current inductors, miniature RF filters, miniature sensors, automotive-grade sensors, high-end lithium batteries, transformers, micro-special motors, RF resistors and capacitors, supercapacitors, control relays, mid-to-high frequency components, specialized PCBs, servo motors, high-speed transmission cables and connectivity assemblies, optical communication devices, etc.

• 集成电路与半导体：芯片设计、制造、封测、设备、材料等全产业链；

Integrated Circuits and Semiconductors: A comprehensive industrial chain covering chip design, manufacturing, packaging and testing, equipment, materials,etc.

• 汽车电子与智能网联：聚焦智能座舱、自动驾驶、车规级芯片、传感器、电源管理等；

Automotive Electronics and Intelligent Connectivity: Focusing on smart cockpits, autonomous driving, automotive-grade chips, sensors, power management,etc.

• 人工智能与物联网生态： AI算法、算力硬件、智能终端、IoT模组与解决方案；

AI and IoT Ecosystem: AI algorithms, computing hardware, smart devices, IoT modules and solutions.

• 5G/6G与通信技术：通信设备、网络解决方案、测试仪器及未来通信技术应用；

5G/6G and Communication Technologies: Communication equipment, network solutions, test instruments, and future communication technology applications.

• 新型显示与智能终端区：Mini/Micro LED、OLED、激光显示等前沿显示技术及消费电子新品；

New Displays and Smart Devices: Cutting-edge display technologies such as Mini/Micro LED, OLED, and laser display, and new consumer electronics products.

• 电子生产设备与自动化：SMT、测试测量、机器人、智能仓储与自动化生产线；

Electronic Production Equipment and Automation: SMT, test and measurement, robotics, intelligent warehousing, and automated production lines.

• 第三代半导体与功率电子：GaN、SiC等宽禁带半导体技术在电力电子、新能源领域的应用；

Third-Generation Semiconductors and Power Electronics: Applications of wide-bandgap semiconductor technologies such as GaN and SiC in the fields of power electronics and new energy .

• 特种电子与军民两用技术：固态微波器件、真空器件、光电器件、半导体分立器件、电能源、机电组件、特种元件、通用元件、支撑基础、元器件相关的微系统、电子功能材料、工艺设备、测试仪器；

Specialized Electronics and Dual-Use Technologies for Civilian And Military Applications: solid-state microwave devices, vacuum devices, optoelectronic devices, semiconductor discrete devices, electrical power sources, electromechanical components, specialized components, general-purpose components, foundational support, microsystems related to components, electronic functional materials, process equipment, test instruments.

• 绿色制造与循环经济专区：节能技术、环保材料、碳足迹管理、电子废弃物回收处理方案。

Green Manufacturing and Circular Economy Zone: Energy-saving technologies, eco-friendly materials, carbon footprint management, and e-waste recycling solutions.

展区设置|Exhibition Areas

1、核心基础元器件展区Core Foundational Components Zone

2、集成电路与半导体展区Integrated Circuits and Semiconductors Zone

3、汽车电子与智能网联展区Automotive Electronics and Intelligent Connectivity Zone

4、人工智能与物联网生态展区AI and IoT Ecosystem Zone

5、5G/6G与通信技术展区5G/6G and Communication Technologies Zone

6、新型显示与智能终端展区New Displays and Smart Devices Zone

7、电子生产设备与自动化展区Electronic Production Equipment and Automation Zone

8、第三代半导体与功率电子展区Third-Generation Semiconductors and Power Electronics Zone

9、特种电子与军民两用技术展区Specialized Electronics and Dual-Use Technologies for Civilian And Military Applications Zone

10、绿色制造与循环经济展区Green Manufacturing and Circular Economy Zone

观众组织|Target Audiences

来自国内外政府、行业组织、消费电子、汽车制造、航空航天、轨道交通、重型机械、生物医药等领域决策者、开发者及消费者。另重点邀请移动终端、智能穿戴、智慧家庭、人工智能机器人、低空经济、数据存算、AI算力、人工智能大模型、运动科技、AR/VR、集成电路、电子元器件、特种电子元器件等专业人士参会。

It will attract decision-makers, developers, and consumers from domestic and foreign governments, industry organizations, consumer electronics, automotive manufacturing, aerospace, rail transit, heavy machinery, and biomedicine. Professionals from fields such as mobile devices, smart wearables, smart home, AI robotics, low-altitude economy, data storage and computing, AI computing power, large-scale AI models, sports technology, AR/VR, integrated circuits, electronic components, and specialized electronic components will be invited to attend with the purpose of purchasing and visiting.

预定展位|Booth Reservation

请立即预定TEIE 2026”展位，越早预留位置越佳，争取最大曝光率，领先竞争对手，开拓无限商机。

Your timely reservation will allow us to preassign exhibit space. Requests for exhibit space will be accepted on a “first come, first served” basis.

如欲预订“TEIE 2026”采购交易会展位，或了解更多信息，请发电子邮件至info@goldenexpo.com.cn 。或通过以下联络方法，预订展位。

To reserve the booth of “TEIE 2026” or learn more information, please contact:

电话/ Tel : (86-21) 6439-6190

E-mail: info@goldenexpo.com.cn