TEIE 2026

2026天津国际电子工业博览会

Tianjin International Electronics Industry Expo 2026

展览时间|Time：

2026年10月15-17日|October 15-17, 2026

展览地点|Venue：

国家会展中心（天津) |National Exhibition and Convention Center (Tianjin)

展会介绍|Exhibition Background

全球电子工业正经历以“智能化、绿色化、融合化”为核心的深刻变革。人工智能、物联网、5G/6G、第三代半导体、绿色制造等新技术驱动产业升级，供应链重构带来新的机遇与挑战。中国作为全球最大的电子制造基地和消费市场，正从“制造大国”向“制造强国”迈进，在政策与市场的双轮驱动下，核心技术创新与自主可控成为关键。天津是北方重要的电子制造业基地，在集成电路、汽车电子、通信设备、人工智能等领域拥有完整的产业链和众多龙头企业。作为京津冀协同发展的重要节点和北方国际航运核心区，天津拥有得天独厚的海、陆、空立体交通网络，辐射全国及东北亚市场。天津市大力发展智能科技产业，为电子工业的创新发展提供了优厚的政策环境和应用场景。

The global electronics industry is undergoing a profound transformation centered on intelligence, sustainability and integration. New technologies such as AI, the Internet of Things, 5G/6G, third-generation semiconductors and green manufacturing are driving industrial upgrades, while the restructuring of supply chains embraces new opportunities and challenges. As the world’s largest electronics manufacturing base and consumer market, China is moving from a major manufacturing country to a strong manufacturing power. Driven by both policy support and market forces, the most crucial factors lie in key and core technological innovation and independent controllability. Tianjin serves as a vital electronics manufacturing base in northern China, boasting a comprehensive industrial chain and numerous leading enterprises in fields such as integrated circuits, automotive electronics, communication equipment and AI. As an important hub for the coordinated development of the Beijing-Tianjin-Hebei region and a core area for international shipping in northern China, Tianjin creates a comprehensive three-dimensional transportation network integrating railway, highway, waterway, and airway, providing strong connectivity across the country and to the Northeast Asian market. At present, Tianjin has been vigorously developing its AI industry, aiming to establish a favorable policy environment and rich application scenarios for the innovative development of the electronics industry.

新的机遇|New Opportunities

为给更多的电子企业搭建集产品展示、贸易洽谈、技术交流、投资合作于一体的国际化平台，助力我国电子工业的高质量发展。在上级主管部门的指导下，高登会展联合相关主管单位将于2026年10月15日-17日在国家会展中心召开“2026天津国际电子工业博览会”，展会以“智汇津门，电定未来”为主题，展会总规划面积为1.5万平米，展品范围涵盖核心基础元器件、集成电路与半导体、汽车电子与智能网联、人工智能与物联网生态、5G/6G与通信技术、新型显示与智能终端、电子生产设备与自动化、第三代半导体与功率电子、特种电子与军民两用技术、绿色制造与循环经济等。

To provide more electronics enterprises with an international platform for product showcasing, trade negotiation, technological exchange, and investment cooperation, and to promote the high-quality development of China’s electronics industry. Under the guidance of relevant authorities, Golden Group, in collaboration with related departments, will hold the Tianjin International Electronics Industry Expo 2026 at the National Convention and Exhibition Center from October 15 to 17, 2026. With the theme “Smart Innovation in Tianjin, Powering the Future,” the expo will cover a total planned area of 15,000 square meters.The exhibits covers a wide range of products, including core components, integrated circuits and semiconductors, automotive electronics and intelligent connectivity, AI and IoT ecosystems, 5G/6G and communication technologies, new display technologies and smart terminals, electronic production equipment and automation, third-generation semiconductors and power electronics, specialized electronics and dual-use technologies for civilian and military applications, as well as green manufacturing and the circular economy.

同期活动|Concurrent Activities

展会同期将举办全国电子工作发展大会、天津集成电路设计年会、智能汽车电子高峰论坛、人工智能芯片与应用创新大会、第三代半导体产业发展论坛、绿色电子制造与可持续发展论坛及多场推介会、首发仪式等多场专业活动。这些活动旨在集聚顶尖专家、企业高管与投资机构，深度探讨全球电子行业发展趋势与关键应用场景，以推动行业交流合作、促进技术创新与产业升级。

During the exhibition, a series of professional events will be held, including the National Conference on Electronic Industry Development, the Tianjin Integrated Circuit Design Annual Conference, the Intelligent Automotive Electronics Summit, the AI Chip and Application Innovation Conference, the Third-Generation Semiconductor Industry Development Forum, the Green Electronics Manufacturing and Sustainable Development Forum, as well as multiple promotion conferences, and product launches. Top experts, corporate executives, and investment institutions will gather in Tianjin to engage in in-depth discussions on global electronics industry trends and key application scenarios, aiming to promote industry collaboration, drive technological innovation, and advance industrial upgrading.

展会目的|Purpose of the exhibition

天津国际电子工业博览会立足中国北方，辐射全球，打造一个集“展览展示、高峰论坛、技术交流、贸易合作、投资促进”于一体的国际级电子工业全产业链平台。该展会正处中国“十四五”规划收官与“十五五”规划开局的关键节点，国家对集成电路、人工智能、工业母机等关键领域的支持力度将持续加大，为展会提供最强劲的政策动力。本届博览会的举办汇聚天时地利，必将成为撬动区域产业升级、强化国家战略科技力量的关键支点，并在全球电子产业格局中奏响强劲的“中国北方之声”。

based in northern China and reaching out globally, the expo is committed to building an international-level platform focusing on the entire industry chain for the electronics industry, integrating dispaly, summits, technological exchanges, trade cooperation, and investment promotion. Meanwhile, the expo takes place at a critical juncture between the conclusion of China’s 14th Five-Year Plan and the launch of the 15th Five-Year Plan. With China continuously increasing support for key sectors such as integrated circuits, AI, and industrial mother machines, the event will benefit from strong policy-driven momentum. The expo comes to describing an advantageous time and location, poised to serve as a key point for driving regional industrial upgrading and strengthening national strategic scientific and technological capabilities, while amplifying the strong “Voice of Northern China” in the global electronics industry.

展品大类|Major Exhibits

• 核心基础元器件：微型片式阻容元件、微型大电流电感器、微型射频滤波器、微型传感器车规级传感器、高端锂电、变压器、微特电机、射频阻容元件、超级电容器、控制继电器、中高频元器件、特种 PCB、伺服电机、高速传输线缆及连接组件、光通信器件等；

Core Foundational Components: Miniature chip-type resistors and capacitors, miniature high-current inductors, miniature RF filters, miniature sensors, automotive-grade sensors, high-end lithium batteries, transformers, micro-special motors, RF resistors and capacitors, supercapacitors, control relays, mid-to-high frequency components, specialized PCBs, servo motors, high-speed transmission cables and connectivity assemblies, optical communication devices, etc.

• 集成电路与半导体：芯片设计、制造、封测、设备、材料等全产业链；

Integrated Circuits and Semiconductors: A comprehensive industrial chain covering chip design, manufacturing, packaging and testing, equipment, materials,etc.

• 汽车电子与智能网联：聚焦智能座舱、自动驾驶、车规级芯片、传感器、电源管理等；

Automotive Electronics and Intelligent Connectivity: Focusing on smart cockpits, autonomous driving, automotive-grade chips, sensors, power management,etc.

• 人工智能与物联网生态： AI算法、算力硬件、智能终端、IoT模组与解决方案；

AI and IoT Ecosystem: AI algorithms, computing hardware, smart devices, IoT modules and solutions.

• 5G/6G与通信技术：通信设备、网络解决方案、测试仪器及未来通信技术应用；

5G/6G and Communication Technologies: Communication equipment, network solutions, test instruments, and future communication technology applications.

• 新型显示与智能终端区：Mini/Micro LED、OLED、激光显示等前沿显示技术及消费电子新品；

New Displays and Smart Devices: Cutting-edge display technologies such as Mini/Micro LED, OLED, and laser display, and new consumer electronics products.

• 电子生产设备与自动化：SMT、测试测量、机器人、智能仓储与自动化生产线；

Electronic Production Equipment and Automation: SMT, test and measurement, robotics, intelligent warehousing, and automated production lines.

• 第三代半导体与功率电子：GaN、SiC等宽禁带半导体技术在电力电子、新能源领域的应用；

Third-Generation Semiconductors and Power Electronics: Applications of wide-bandgap semiconductor technologies such as GaN and SiC in the fields of power electronics and new energy .

• 特种电子与军民两用技术：固态微波器件、真空器件、光电器件、半导体分立器件、电能源、机电组件、特种元件、通用元件、支撑基础、元器件相关的微系统、电子功能材料、工艺设备、测试仪器；

Specialized Electronics and Dual-Use Technologies for Civilian And Military Applications: solid-state microwave devices, vacuum devices, optoelectronic devices, semiconductor discrete devices, electrical power sources, electromechanical components, specialized components, general-purpose components, foundational support, microsystems related to components, electronic functional materials, process equipment, test instruments.

• 绿色制造与循环经济专区：节能技术、环保材料、碳足迹管理、电子废弃物回收处理方案。

Green Manufacturing and Circular Economy Zone: Energy-saving technologies, eco-friendly materials, carbon footprint management, and e-waste recycling solutions.

展区设置|Exhibition Areas

1、核心基础元器件展区Core Foundational Components Zone

2、集成电路与半导体展区Integrated Circuits and Semiconductors Zone

3、汽车电子与智能网联展区Automotive Electronics and Intelligent Connectivity Zone

4、人工智能与物联网生态展区AI and IoT Ecosystem Zone

5、5G/6G与通信技术展区5G/6G and Communication Technologies Zone

6、新型显示与智能终端展区New Displays and Smart Devices Zone

7、电子生产设备与自动化展区Electronic Production Equipment and Automation Zone

8、第三代半导体与功率电子展区Third-Generation Semiconductors and Power Electronics Zone

9、特种电子与军民两用技术展区Specialized Electronics and Dual-Use Technologies for Civilian And Military Applications Zone

10、绿色制造与循环经济展区Green Manufacturing and Circular Economy Zone

参展费用|Participation Fees

★ 标准展位：

A：国内企业：标准展位16800.00/展期（RMB）3m×3m

B：国外企业：标准展位4800.00/展期（USD）3m×3m

展位包括：三面白色壁板、中（英）文楣牌制作、咨询桌一张、折椅二把、地毯满铺、展位照明、220V/5A电源插座一个、废纸篓一个。）

★ 室内光地：

A：国内企业：1600（RMB）/平方米

B：国外企业：480（USD）/平方米

注：（最少36平方米起租）“光地”只提供参展面积，不包括展架、展具、地毯、电源等。 International Standard Booths:

For overseas enterprises: USD 4800.00/Expo; 3m×3m

Each standard booth consists of 3-sided white wallboards, Chinese& English fascia board, 1 consultation desk, 2 folding chairs, fully-floored carpet, booth lighting system, 1 power socket 220V/5A, and a waste basket.

Indoor Raw Space:

For overseas enterprises: USD 480.00/Sq.m.

Note: The raw space (minimum 36 sq.m.) only supplies a show space excluding stand frames, show equipment, carpet and power supply, etc.

观众组织|Target Audiences

来自国内外政府、行业组织、消费电子、汽车制造、航空航天、轨道交通、重型机械、生物医药等领域决策者、开发者及消费者。另重点邀请移动终端、智能穿戴、智慧家庭、人工智能机器人、低空经济、数据存算、AI算力、人工智能大模型、运动科技、AR/VR、集成电路、电子元器件、特种电子元器件等专业人士参会。

It will attract decision-makers, developers, and consumers from domestic and foreign governments, industry organizations, consumer electronics, automotive manufacturing, aerospace, rail transit, heavy machinery, and biomedicine. Professionals from fields such as mobile devices, smart wearables, smart home, AI robotics, low-altitude economy, data storage and computing, AI computing power, large-scale AI models, sports technology, AR/VR, integrated circuits, electronic components, and specialized electronic components will be invited to attend with the purpose of purchasing and visiting.

预定展位|Booth Reservation

请立即预定TEIE 2026”展位，越早预留位置越佳，争取最大曝光率，领先竞争对手，开拓无限商机。

Your timely reservation will allow us to preassign exhibit space. Requests for exhibit space will be accepted on a “first come, first served” basis.

如欲预订“TEIE 2026”采购交易会展位，或了解更多信息，请发电子邮件至info@goldenexpo.com.cn 。或通过以下联络方法，预订展位。

To reserve the booth of “TEIE 2026” or learn more information, please contact:

电话/ Tel : (86-21) 6439-6190

E-mail: info@goldenexpo.com.cn